Advanced pixel and autofocus technology overcomes typical response, image quality and low light performance limitations
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21ic News ON Semiconductor has announced the addition of a next-generation optical anti-shake (OIS)/autofocus (AF) driver LC898123AXD to its lineup to best serve smartphones, tablets, laptops and wearables. The digital camera and video experience overcomes the performance limitations of traditional camera modules by using advanced autofocus and optical image stabilization techniques.
The LC898123AXD OIS / AF driver integrates a digital signal processing (DSP) core and multiple analog peripherals for image stabilization, autofocus control, and H-bridge and constant current drive. The addition of on-chip flash memory provides storage of DSP programs and calibration parameters, saving 90% of the time required to load from traditional memory at boot time. This highly integrated solution accelerates the application of OIS and AF functions to camera modules while being compatible with a wide range of image sensors. In addition, highly integrated features support the needs of extremely thin camera modules.
Tomofumi Watanabe, head of Power Solutions Product Solutions at ON Semiconductor's Smart Power Solutions Division, said: "The latest smartphone models are increasingly demanding enhanced image clarity and quality, as busy consumers want better and better users. Experience, regardless of the size of the phone. The LC898123AXD enables camera module designers to meet these ever-increasing requirements."
The LC898123 offers best-in-class current consumption and improved battery life. DSP performance and flexibility support a variety of VCM drivers. The high-performance 32-bit DSP is optimized for OIS/AF signal processing and covers many functions such as servo control, gyro data filtering and host command interface. In addition, the LC898123 provides an "Advanced Instructions" feature to standardize commands from the host CPU to the camera module, enabling handset developers to use standardized instructions for a wide variety of camera modules/drivers without changing the CPU software.
The company now offers camera module integrator-specific reference designs to accelerate OIS/AF assessments and reduce development effort.
Packaging and pricing
The LC898123AXD is available in a lead-free WLCSP-35 package and is priced at $2.18 per unit in 4,000-piece quantities.
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