LED Thermal Ceramics - Analysis of Laser Drilling Technology

Heat-dissipating ceramics have been paid more and more attention due to the development of high-power LEDs . This is because ceramics have excellent properties such as insulation, heat resistance and stability, which not only can resist high pressure, no deformation, no oxidation and no yellowing, but also The absolute advantage of the coefficient of thermal expansion (CTE) associated with the LED chip .

The heat-dissipating ceramics can be classified into two processes: HTCC (High Temperature Co-fired Ceramics) and LTCC (Low Temperature Co-fired Ceramics). The LTCC ceramics are perforated and positioned on the soft-baked raw embryos, and then Co-fired under the process conditions of 850 ° C, although this technology is easy to shape, but the ceramics are low in density, resulting in low thermal conductivity, poor mechanical strength and insulation properties, the most important is the green embryo after sintering There will be problems with shrinkage, which will lead to breakthroughs in dimensional accuracy. Therefore, the more elaborate lines are mostly modified with HTCC ceramics. The ceramics are sintered at a high temperature of 1300~1600°C, which makes them have better mechanical properties than LTCC ceramics, and further drills the surface of the substrate without dimensional accuracy. .

However, due to the extremely superior mechanical strength characteristics of ceramics, it is difficult to process on the surface with conventional cutting tools, so it is usually processed with a diamond knife (Diamond Saw) or a laser (Laser). Cutting with a lower cost diamond knife will cut the mechanical force in this way, which will not only cause the tool loss to be replaced, but also cause unevenness or cracking of the cutting edge of the substrate, in addition to water. Cooling limits the application of many processes. The laser not only has the advantages of high precision, local processing, rapid cutting and easy control of cutting images, but also is not limited by the hardness, brittleness and melting point of the material. Therefore, the laser technology is introduced into the ceramic cutting hole.

Unlike conventional spontaneous emission sources, lasers are sources of light that are stimulated by radiation, and this theory was inferred by Einstein in 1917, and it was not produced by Theodore Malman in 1960. Light Amplification by Stimulated Emissions of Radiation (LASER), which is a radiation source that is enhanced by stimulation radiation.

Laser theme mechanism schematic

Figure 1: Schematic diagram of the laser subject mechanism

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