Thermal resistance is the obstruction effect of an object on heat conduction. The unit of thermal resistance is °C/W, that is, the temperature difference between the two ends of the heat conduction path when the continuous heat transfer power of the object is 1W. Refers to the thermal resistance of LED lighting LED, when conducting heat stability, 1W dissipation per chip surface, the outside temperature and the temperature of the PN junction between the heat-dissipating substrate or branched plus online difference is that the LED thermal resistance Rth. The thermal resistance value is generally expressed by θ or R, where Tj is the temperature at the junction position, Tx is the temperature at which the heat is transmitted to a certain point, and P is the heat generated by the junction. A large thermal resistance means that heat is not easily transmitted, so the temperature generated by the kit is higher than the ratio, and the thermal resistance can be used to judge and predict the heating condition of the kit. The lower the °C/W value, the faster the heat in the chip is transmitted to the outside. Therefore, reducing the temperature of the PN junction in the chip is beneficial to the extension of the LED lifetime.
So what are the main factors that affect the thermal resistance of LED components? How to reduce the thermal resistance of LED components?
1, LED chip architecture and raw materials are also one of the factors affecting the size of LED thermal resistance, reducing the thermal resistance of the LED itself is an early condition;
2. Heat sink materials with different thermal conductivity, such as copper and aluminum, have a great influence on the thermal resistance of LEDs. Therefore, selecting a suitable heat sink material is also one of the methods to reduce the thermal resistance of LED components.
3. The same heat sink material is used, which is also directly related to the size of the heat dissipation area. The secondary heat dissipation design is good, and the area is large, which reduces the thermal resistance accordingly. This has a great effect on the LED luminous efficiency and life extension. Great effect.
4, LED chip with thermal adhesive is still directly connected to the metal, including thermal grease and metal different materials will affect the LED thermal resistance. The thermal resistance between the LED and the secondary heat sink loading interface should be minimized.
5. The high temperature of the working environment of the LED component will also affect the thermal resistance of the LED component and minimize the ambient temperature.
6, select a certain material and control the rated power and other technical details, in order to improve the LED luminous efficiency and extend the life of the LED premise, deal with the heat dissipation problem of LED.
Simple induction, we must consider the following points in the LED design:
1. Reduce the thermal resistance of the chip.
2. Optimize the hot aisle.
a. Channel architecture: the shorter the length (L), the better; the larger the area (S), the better; the fewer the better, the better the heat conduction bottleneck on the channel.
b. The larger the thermal conductivity λ of the channel material, the better.
c. Improve the packaging process to make the interface between the channel links more compact and reliable.
3. Strengthen the conduction/heat dissipation function of the electrical channel.
4. Select the light-emitting channel material with higher conductivity and heat dissipation.
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