Apple's release of the iPhone 8, 8 Plus, and X sparked widespread attention across the industry. These latest models continue to uphold the ultra-thin design while incorporating numerous new features. The slimness of the device is not just a design choice but a result of advanced technology. Not surprisingly, Apple has continued to use a cutting-edge packaging solution: System-in-Package (SiP) technology. This method was already used in the iPhone 7 and Apple Watch, proving its effectiveness and reliability.
So, what exactly is SiP? It's a packaging technology that integrates multiple functional chips—like processors and memory—into a single package to create a complete subsystem. Unlike SoC (System-on-Chip), which is a highly integrated single-chip solution, SiP uses a side-by-side or stacked configuration with different chips. It can combine active and passive components such as CMOS-based, GaAs, GaN, and MEMS technologies. As smartphones become smaller and more powerful, SiP has gained significant traction in the market.
The structure of SiP can be either 2D or 3D. While 2D packages are flat, 3D stacking allows for more layers and greater integration. Internal bonding methods include wire bonding, flip-chip, or a combination of both. Additionally, multi-functional substrates can integrate various components, offering flexibility and customization.
Looking at the iPhone 7, it featured advanced packaging like SiP and WLCSP. For instance, Avago’s PA and Skyworks’ PA were both packaged using SiP technology. With the push for miniaturization, the adoption of SiP is growing rapidly. Industry analysts predict that the global advanced packaging market will grow at a 7% annual rate from 2015 to 2020, reaching $4 billion in China by 2020.
Five key factors have driven the development of SiP: miniaturization, component integration, process flexibility, improved signal integrity, and system reconfigurability. Manufacturers also benefit from reduced BOM costs, simpler board designs, fewer PCB layers, and faster time-to-market.
Beyond Moore’s Law, SiP offers an alternative path. While Moore’s Law focuses on shrinking transistors, SiP emphasizes system-level integration. It enables the combination of RF, analog, storage, and other components into one package. This approach supports the growing demand for compact, efficient, and flexible systems.
SiP is widely used in smartphones, wearables, and healthcare devices. In mobile phones, it can integrate modules like RF, Wi-Fi, and PA. Its advantages include higher packaging efficiency, lower design complexity, cost reduction, and better performance.
Currently, leading packaging companies are investing heavily in SiP. For example, Amkor Technology reported $725 million in revenue from SiP in 2015, with a 16% growth rate. The nine main benefits of SiP include increased efficiency, reduced design complexity, cost savings, and support for diverse applications.
Despite its advantages, SiP still faces challenges. Collaboration between system vendors, chip manufacturers, and packaging firms is essential. To foster this cooperation, the first-ever SiP conference in China—SiP China—will take place on October 19–20, 2017, at the Hilton Nanhai Hotel in Shekou, Shenzhen. This event aims to bring together experts and promote innovation in SiP technology.
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