A new breakthrough in LED heat dissipation, "copper-aluminum metal bonding" technology solves the problem

MicroSolar has developed a "copper-aluminum-metal bonding" technology that can be applied to high-power, high-brightness LED lamp heat dissipation, and has successfully produced White MR16 LED Lamp and single-chip 8W White E27 LED Lamp, which is now being sampled. .


LED Lamp, which is expected to become a new generation lighting application, has the advantages of power saving, environmental protection, carbon reduction, long life, small size, light weight, fast starting speed, and can be used in low temperature environment; however, it is limited by heat dissipation. The bottleneck is still not widely applicable in various fields. Therefore, MicroSolar has developed a new super-thermal material and technology that does not require the use of a fan, heat sink, heat pipe or loop heat pipe. Instead, it uses the aluminum body as a heat sink to transmit thermal energy to the aluminum body through a super-thermally conductive material. It is then released from the aluminum body to the air.



MicroSolar's copper-aluminum bonding technology fully reduces the 5V voltage to a high-power, high-brightness LED lamp without the use of a current-limiting resistor, producing approximately 1,500 lumens of brightness. Through good thermal conductivity technology applications, such as LED Lamp operation under the 0.35Ax3.5V high power, high brightness LED Lamp, it will provide LED lighting with more power saving, longer life and better electro-optical conversion efficiency.



At present, MicroSolar has successfully introduced 5A current into a single LED lamp with a brightness of 1,500 lumens. In the future, it will introduce a single LED lamp with a current of 10A, and energy-saving LEDs will be widely used in the lighting market and other IT cooling industries. (small soup)


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