MicroSolar has developed a copper-aluminum metal bonding technology that can be applied to high-power, high-brightness LEDLamp heat dissipation, and has successfully produced WhiteMR16LEDLamp and single-chip 8W WhiteE27LEDLamp, which is now being sampled.
LEDLamp, which is expected to become a new generation lighting application, has the advantages of power saving, environmental protection, carbon reduction, long life, light weight, fast starting speed, and low temperature environment; however, it is limited by the thermal bottleneck. It is still not widely available in various fields. Therefore, MicroSolar has developed a new super-thermal material and technology that does not require the use of a fan, heat sink, heat pipe or loop heat pipe. Instead, it uses the aluminum body as a heat sink to transmit thermal energy to the aluminum body through a super-thermally conductive material. It is then released from the aluminum body to the air.
MicroSolar's copper-aluminum bonding technology fully reduces the 5V voltage to a high-power, high-brightness LEDLamp without the use of a current-limiting resistor, producing approximately 1,500 lumens of brightness. Through good thermal conductivity technology applications, such as LEDLamp operation under the 0.35Ax3.5V high power, high brightness LEDLamp, will provide more energy-saving, longer life, better electro-optical conversion efficiency LED lighting.
At present, MicroSolar has successfully introduced 5A current into a single LED lamp with a brightness of 1,500 lumens. In the future, it will introduce a single LEDlamp with a current of 10A, and the energy-saving LED will be widely used in the lighting market and other IT cooling industries.
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