Solve the key factors of LED lamp heat dissipation

The problem of LED lamp heat dissipation becomes a problem that current LED manufacturers can not afford to ignore. It is also a fatal problem for LED lamps and lanterns. At present, LED lighting components: structure, electronics, and LED light source are composed of three major components. The main cause of heat generation is in electronics and LED light sources. In part, then the structure is used to dissipate heat. Changing the LED lamp heat dissipation can be handled with a better quality structure, which can be costly, and it is not a better way to use the “tools” of structure to solve the heat dissipation. The so-called palliative treatment is not a solution to the problem. Good can not solve the real problem, in fact, Xiao Bian really do not understand why a large number of manufacturers in the search for structure as painstaking, (of course does not refer to more than ten people in the workshop factory) why not LED lighting sources to solve practical problems. Solve the heat problem in two parts: 1. Electronic and LED light source, because the electronic cooling part mainly depends on the quality of the electronic components and the size of the power of the load, because the LED lamp power is not large, so the electronic heat dissipation is similar to the domestic situation, Therefore, Xiao Bian thinks that there is no room for improvement in electronic cooling except for technological improvements. (Of course welcome everyone's guidance)

The following LED light source cooling to improve sharing:

1. In addition to LED chips using integrated packaging, (the smaller the wafer power the better) the best use of multi-face integrated package. That is the MCOB package. Because the smaller the power of the wafer, the smaller the amount of heat generated, the more proportional it will be.

2. The lamp bead of the male model lamp bead (that is specialized in the production of the LED package enterprise) such as 3014 is made by putting the chip into the module, coating the phosphor and then into the silica gel, the LED chip itself is large Power, the heat generated is too high, coupled with heat mainly by the two corners of the wafer gold or copper wire, these two materials are very small, and the heat itself is not good, so the heat can not be dispersed.

If the production process uses MCOB polyhedron packaging technology, put the low-power wafer into the module, the wafers are separated by a certain distance in the module, and the wafers are connected by gold wire, then each wafer except the labeling module surface does not emit light, and the other five The face can be illuminated, called MCOB, polyhedron integrated package. There is a gold wire connection between the wafers to increase the heat dissipation area, and then add the silica gel directly to the MCOB package surface. Different color temperature phosphors are applied to a plastic sleeve (fluorescent cover) to change the color temperature of the lamp. Then there is a certain treatment between the plastic sleeve and the wafer to increase the heat dissipation capability.

If the above process is used to improve the heat dissipation of the LED light source, the LED heat dissipation problem can be greatly reduced.