ST introduces three cable modem chips that support the DOCSIS 3.0 standard

21ic News STMicroelectronics (STMicroelectronics) has introduced three new cable modem chips that support the DOCSIS 3.0 standard.

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STMicroelectronics Plays Cable Technology Expertise to Promote Next Generation Multimedia and Internet Services Development_Copy.jpg

Since its first release of its DOCSIS 3.0 technology in September 2012, STMicroelectronics has introduced STiD125 12-channel and STiD127 16-channel modem chips for set-top boxes or gateway front ends with displays, as well as STiD128 16-channel cable modems and data gateways (including Gateway front end with modem) modem chip. Recognized as the first product to support the DOCSIS 3.0 specification, these three products offer up to 16 downstream channels and 4 upstream channels with uplink and downlink data rates of 108 Mbps and 800 Mbps, respectively.

DOCSIS 3.0 provides a standard framework for moving home and mobile multimedia from traditional MPEG to IP video transport. Extremely high data rates allow set-top boxes and home gateways to deliver a mix of data and video over a single network, allowing users to simultaneously use multiple connected devices, such as smart TVs, digital video recorders (DVRs), tablets, Smartphones and game consoles. With the release of the DOCSIS 3.0 standard, market research firm IMS predicts that the annual sales of DOCSIS equipment will increase from 32 million units in 2012 to more than 49 million units in 2015.

STMicroelectronics DOCSIS 3.0 cable modem technology uses an ARM® CortexTM-A9 dual-core processor to control routers, switches and call functions. ST's DOCSIS 3.0 devices, combined with its advanced set-top box chips (such as the Orly STiH416), provide security and media server capabilities for network services used in pay-TV and next-generation network appliances.

Laurent Remont, vice president and general platform product division of STMicroelectronics, said: "The rapid launch of these three products benefits from ST's proprietary and market-proven proprietary technology in this technology field. STMicroelectronics has sold tens of millions of first- and second-generation DOCSIS chips. We are the first semiconductor company in the industry to release 16x4 channel DOCSIS 3.0 technology. The data rate of the new series allows operators to use the home network to More networked users offer more advanced services."

STMicroelectronics will release the product development kit (PDK) for the STiD125, STiD127 and STiD128 in the 23x23 BGA package in the first quarter of 2013.

STMicroelectronics leverages cable technology expertise to promote next-generation multimedia and Internet services.

Main features of STiD125/127/128:

· Multiple DOCSIS 3.0 high speed channels: up to 16x4 data channels and 8 video channels

· Rich interface: full spectrum tuner interface, up to 3 Ethernet ports and 2 PCI-e (Wi-Fi DBC) ports, 200Mb/s digital video transmission stream bus output

· Enhanced Internet telephony technology that supports PacketCableTM 1.5 and 2.0

Low-power, high-performance multi-core ARM processor with industry best power and performance

ST's latest digital home solutions will be unveiled at the 21st China International Television Broadcasting Information Network Exhibition (CCBN) in Beijing on March 21-23, 2013. STMicroelectronics booth is located at No. 3205, Hall 3, China International Exhibition Center.

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